THERMOSETTING AT MODERATE TEMP., HIGH STRENGTH EPOXY ADHESIVE

The present modified epoxy adhesive mainly comprises of: (1) 100 parts (wt.) of a thermosetting mixed resin of two or more epoxy resins, each molecule of which has at least two epoxy rings as terminal groups,preferably at least one of epoxy resin is solid and the other is liquid at 25 deg.C. (2) 5-3...

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Bibliographic Details
Main Authors SUN YISHI, ZAO SHIQI, LIN XIUYING, WANG SIQUN
Format Patent
LanguageEnglish
Published 13.08.1986
Edition4
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:The present modified epoxy adhesive mainly comprises of: (1) 100 parts (wt.) of a thermosetting mixed resin of two or more epoxy resins, each molecule of which has at least two epoxy rings as terminal groups,preferably at least one of epoxy resin is solid and the other is liquid at 25 deg.C. (2) 5-30 pts of liquid butyronitrile rubber of average mol. wt.3000-4000, its vinylcyanide content is 20-30%,and average 1.7 carboxyl groups as terminal groups of each molecule. (3) Small amount of potential solidification agent which is stable at 25 deg.C. but solidifying at 120 deg.C, and promoter as well as some thixological agents. This adhesive can be used without mixing with other components, and can be made into adhesive film, adhesive liquid or adhesive stick.
Bibliography:Application Number: CN1985100135