Point-contact silicon chip thickness measuring instrument

• Main Author: XINFENG HE
• Format: Patent
• Language: English
• Published: 03.01.2007
• Subjects: MEASURING; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS; MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS; PHYSICS; TESTING

The utility model relates to a point contact silicon slice thickness gauge which is specially applied in the manufacturing process of integrated circuit to inspect the silicon slice. It comprises a dial indicator, wherein, it also comprises a work table, a measuring head, and a cantilever bracket. The work table is set horizontally and the center of it is enchased with a lower steel ball slightly coming out the table surface. The cantilever bracket is fixed on the work table and the other end of the cantilever bracket is fastened with a dial indicator. The measuring head is installed at the lower end of the indicator pole and the lower end of the measuring head is enchased with an upper steel ball which is corresponding to the lower steel ball on the work table and the diameter for the upper and lower steel balls should be the same. The trunk of the measuring head is installed with a compression spring. The upper and lower steel balls in this utility model contact point-to-point with the inspected silicon slice, but the silicon slice does not contact with the work table. The inspected silicon slice can move randomly on the round work table. The above satisfies the requirement of inspecting the thickness of any point of the 4''~8'' silicon slice' s surface. This utility model is simple in structure and the inspecting the thickness of the silicon slice is very convenient and safe. Any point can be inspected with high precision.