Semiconductor device
The utility model provides a semiconductor device which is provided with an upper metallized layer and a lower metallized layer electrically connected to the upper metallized layer. The utility model has the fabricating method that a thin stopping layer is formed on the lower metallized layer, where...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
05.07.2006
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Subjects | |
Online Access | Get full text |
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