Thin-film circuit board structure

The utility model discloses a thin film circuit board structure which comprises a base plate, a first conducting wire, a fake conducting wire, an insulating material and a second conducting wire. The first conducting wire is arranged on the base plate, the fake conducting wire is arranged on the bas...

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Bibliographic Details
Main Author SHIHONG ZHAO
Format Patent
LanguageEnglish
Published 17.08.2005
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SWITCHES
ELECTRICITY
EMERGENCY PROTECTIVE DEVICES
RELAYS
SELECTORS
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Summary:The utility model discloses a thin film circuit board structure which comprises a base plate, a first conducting wire, a fake conducting wire, an insulating material and a second conducting wire. The first conducting wire is arranged on the base plate, the fake conducting wire is arranged on the base plate and is separated with the first conducting wire with a certain space, the insulating material is formed on the base plate, the first conducting wire and the fake conducting wire. The second conducting wire is arranged on the insulating material and is separated with the first conducting wire via the insulating material and the fake conducting wire in order to assure the second conducting wire is insulating isolated with the first conducting wire.
Bibliography:Application Number: CN2004251188U