Bidirectional transmitting/receiving module (Bi-Di TRx) using chip direct package process (COB)

The utility model relates to a bidirectional transmitting/receiving module (Bi-Di TRx) using chip direct package process (COB), comprising a sensitization assembly and a light emitting source. The sensitization assembly is directly formed by the encapsulation of the chips (COB, Chip and On Board) an...

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Bibliographic Details
Main Authors YAOYU GUAN, XUEQUN XU
Format Patent
LanguageEnglish
Published 04.05.2005
Edition7
Subjects
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
TRANSMISSION
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Summary:The utility model relates to a bidirectional transmitting/receiving module (Bi-Di TRx) using chip direct package process (COB), comprising a sensitization assembly and a light emitting source. The sensitization assembly is directly formed by the encapsulation of the chips (COB, Chip and On Board) and adheres to a printed circuit board (PCB and Print Circuit Board), for receiving a first light signal. The light emitting source is formed by the encapsulation of TO-can and is used for transmitting a second light signal.
Bibliography:Application Number: CN2003279879U