Semiconductor package

• Main Authors: YOU TING, LI MINGTAN, LIU ZIZHENG, GUO HONGRUI
• Format: Patent
• Language: Chinese; English
• Published: 23.07.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Various embodiments of the utility model relate to a semiconductor package. The semiconductor package comprises a first crystal grain, a second crystal grain and a redistribution layer structure. The first crystal grains and the second crystal grains are arranged in the side direction. A redistribution layer structure disposed over and electrically connected to the first die and the second die, where the redistribution layer structure includes a plurality of vias and a plurality of lines, the plurality of vias and the plurality of lines are alternately stacked and electrically connected to each other and embedded in the plurality of polymer layers, and where the plurality of vias and the plurality of lines are electrically connected to each other from a top view. A first via of the plurality of vias overlapping the first die or the second die has a shape similar to an ellipse. 本实用新型实施例的各种实施例涉及一种半导体封装，其包括第一晶粒、第二晶粒及重布线层结构。第一晶粒及第二晶粒在侧向上设置。重布线层结构设置于第一晶粒及第二晶粒之上且电性连接至第一晶粒及第二晶粒，其中重布线层结构包括多个通孔及多条线，所述多个通孔与所述多条线交替地堆叠且电