Semiconductor device heat dissipation performance testing device

• Main Authors: CHEN YONGYU, LI BEIYIN, SHEN HONGXING
• Format: Patent
• Language: Chinese; English
• Published: 25.06.2024
• Subjects: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MEASURING; MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES; PHYSICS; TESTING

The utility model relates to the technical field of semiconductor device testing, and discloses a semiconductor device heat dissipation performance testing device which comprises a testing table, slots are formed in the two sides of the upper surface of the testing table, power connection grooves are formed in the bottom ends of the slots, sliding grooves are formed in the front sides of the power connection grooves, and sliding strips are slidably connected into the sliding grooves. And a first spring is arranged on one side of the sliding strip. The two sets of power connection blocks on the rear side of the sliding strip can be pushed to move leftwards in the power connection grooves through the elastic force of the first spring and are tightly attached to the pins of the semiconductor device, the situation that the power connection blocks and the pins of the semiconductor device are loosened, and the testing precision is affected is avoided, and the limiting blocks can be pushed to move downwards in the l