Small-size DFN packaging structure

• Main Authors: ZHU CHENGKUN, ZHAO LIMING, LU YANWEI, ZHANG YI, HAN LEI, LIANG YONGCHANG
• Format: Patent
• Language: Chinese; English
• Published: 21.06.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The utility model discloses a small-size DFN packaging structure which comprises a frame body and a plastic packaging body, a chip is arranged on the front face of the frame body, a first left pin, a first middle pin and a first right pin are sequentially arranged on the lower side of the frame body, and a second left pin, a second middle pin and a second right pin are sequentially arranged on the upper side of the frame body. The first left pin and the second left pin are respectively provided with a first welding part protruding out of the left side edge of the chip, the first right pin and the second right pin are respectively provided with a first welding part protruding out of the right side edge of the chip, and the first middle pin is provided with a first middle welding part protruding out of the left side edge of the chip. The first middle pin is provided with a first middle welding part protruding out of the right side edge of the chip, the second middle pin is provided with a second middle welding