Semiconductor packaging waste collecting device
The utility model relates to a semiconductor packaging waste material collecting device which comprises a shell, a collecting box arranged in the shell, a vibrating device for driving the collecting box to vibrate up and down, an observing piece for observing the height of waste materials in the col...
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Main Author | |
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Format | Patent |
Language | Chinese English |
Published |
21.06.2024
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Subjects | |
Online Access | Get full text |
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Summary: | The utility model relates to a semiconductor packaging waste material collecting device which comprises a shell, a collecting box arranged in the shell, a vibrating device for driving the collecting box to vibrate up and down, an observing piece for observing the height of waste materials in the collecting box, a detecting piece for detecting whether the waste materials in the collecting box reach a set value or not and a warning lamp convenient for workers. An extending edge is arranged on the collecting box; the shell is inserted into a gap between the extension edge and the collecting box; observation pieces are arranged on the collection box and the shell; the observation piece is transparent; detection pieces are arranged on four surfaces of the collection box; detection pieces are arranged at the bottom of the collection box and below the observation piece; the warning lamp is arranged on the shell; and the warning lamp is electrically connected with the detection piece. The problems that a cut frame is |
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Bibliography: | Application Number: CN202322602700U |