Gluing device for electronic component

• Main Authors: LU XINGLEI, WANG QIAN, HU HAIPENG
• Format: Patent
• Language: Chinese; English
• Published: 18.06.2024
• Subjects: APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; PERFORMING OPERATIONS; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING

The utility model relates to an electronic component gluing device which comprises a workbench, an inverted U-shaped supporting frame is fixed on the workbench, a placing seat is arranged above the workbench, a mounting seat is mounted below a suspension of the supporting frame through a three-axis moving module, and the three-axis moving module is used for driving the mounting seat to move up and down, left and right and front and back. A gluing head is mounted on the lower surface of the mounting seat, and is positioned above the placement seat; an air suction cover is mounted on the lower surface of the mounting base and located on the periphery of the gluing head, and a sleeve cover capable of moving up and down sleeves the air suction cover. According to the utility model, the air suction cover and the sleeve cover are additionally arranged at the periphery of the gluing head on the mounting seat and cover the gluing head and the electronic component, so that during dispensing, air containing glue smell