Circuit board assembly

• Main Authors: WAN MENG, REN WENRUI, YANG ZELIANG, LIU HUIHU, YUAN YUSHEN
• Format: Patent
• Language: Chinese; English
• Published: 14.06.2024
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The utility model belongs to the technical field of circuit boards, and particularly relates to a circuit board assembly. The circuit board assembly comprises a substrate, the surface of the substrate is provided with a plurality of pad assemblies at intervals, the surface of the substrate is covered with a solder mask, the plurality of pad assemblies comprise a first assembly, the first assembly comprises a first pad and a second pad which are arranged at intervals, a first glue passing groove is formed between the first pad and the second pad, and a second glue passing groove is formed between the first pad and the second pad. The first glue passing groove extends in the thickness direction of the substrate, a first glue injection groove is formed in the part, located outside the first bonding pad and the second bonding pad, of the solder mask layer, and the first glue injection groove is communicated with the first glue passing groove. According to the circuit board assembly, at least one part of the solde