Laser apparatus

• Main Authors: HUANG YU, YAO ZHIQIN, PAN MINGHAO, CHEN QIUXING
• Format: Patent
• Language: Chinese; English
• Published: 11.06.2024
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

The utility model discloses laser equipment, which is applied to chip stripping on a wafer and comprises a laser head, a support, a first driving device and a mask plate. Wherein the wafer can be connected to the support, the mask plate is located between the support and the laser head, and the mask plate is provided with a mask hole with a preset mask pattern in a penetrating mode in the laser emitting direction of the laser head; the mask plate is connected with the first driving device so as to move along the laser emission direction of the laser head under the driving of the first driving device, and the mask plate has an initial position and a working position; when the mask plate is located at the initial position, the mask plate and the wafer are arranged at an interval; and when the mask plate is located at the working position, the mask plate is in contact with the wafer, and laser generated by the laser head irradiates and peels off the corresponding chip after being patterned by the mask plate. The