Inner-layer circuit board vacuum conveying device and inner-layer circuit board processing equipment

The utility model discloses an inner-layer circuit board vacuum conveying device and inner-layer circuit board processing equipment, and the inner-layer circuit board vacuum conveying device comprises a vacuum material suction mechanism which is located above an inner-layer circuit board placing mec...

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Bibliographic Details
Main Author HUO JINCHONG
Format Patent
LanguageChinese
English
Published 28.05.2024
Subjects
CONVEYING
HANDLING THIN OR FILAMENTARY MATERIAL
PACKING
PERFORMING OPERATIONS
PNEUMATIC TUBE CONVEYORS
SHOP CONVEYOR SYSTEMS
STORING
TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING
TRANSPORTING
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Summary:The utility model discloses an inner-layer circuit board vacuum conveying device and inner-layer circuit board processing equipment, and the inner-layer circuit board vacuum conveying device comprises a vacuum material suction mechanism which is located above an inner-layer circuit board placing mechanism, and the material suction end of the vacuum material suction mechanism is opposite to the inner-layer circuit board placing mechanism; the output end of the driving mechanism is connected with the vacuum material suction mechanism, and the driving mechanism drives the vacuum material suction mechanism to move back and forth above the inner layer circuit board placing mechanism. Compared with a traditional mode that the vacuum material suction mechanism is arranged below the inner-layer circuit board placing mechanism, the position of the vacuum material suction mechanism is optimized, the vacuum material suction mechanism is arranged above the inner-layer circuit board placing mechanism, a traditional downwa
Bibliography:Application Number: CN202322637936U