Circuit board and electronic equipment

• Main Authors: ZHANG ZHENG, XU SONGZHE, HUANG JIANRONG, YAN MINGHONG, CHI YONGLUN, CHEN YURU
• Format: Patent
• Language: Chinese; English
• Published: 24.05.2024
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The utility model relates to a circuit board and electronic equipment. The circuit board comprises a multifunctional resistance bonding pad, the multifunctional resistance bonding pad comprises a first resistance bonding pad and a second resistance bonding pad, a preset area is arranged between the first resistance bonding pad and the second resistance bonding pad, and a third resistance bonding pad is arranged in the center of the preset area. And the size of the third resistance bonding pad is smaller than a first preset size. Therefore, the space of the circuit board can be saved, and the test accuracy and the detection yield can be improved. 本申请涉及一种电路板以及电子设备。所述电路板包括多功能电阻焊盘，所述多功能电阻焊盘包括第一电阻焊盘和第二电阻焊盘，以及在所述第一电阻焊盘和第二电阻焊盘之间设置有预设区，在所述预设区的中心位置设置的第三电阻焊盘，且所述第三电阻焊盘的尺寸小于第一预设尺寸。如此，能够节省电路板的空间，提高测试准确度以及检测良率。