Circuit board copper deposition equipment

• Main Authors: MA JIDONG, TANG LIRONG, ZHAN JIANJUN, SHEN YAN, MA SHOUCHENG, ZHOU JIANJUN
• Format: Patent
• Language: Chinese; English
• Published: 14.05.2024
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PRINTED CIRCUITS; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The utility model discloses copper deposition equipment for a circuit board, which relates to the technical field of copper deposition equipment and comprises a copper deposition box. A containing mechanism and a lifting mechanism are arranged in the copper deposition box, a flow guide mechanism is arranged on the right upper side of the copper deposition box, and a liquid pumping mechanism is arranged on the left lower side of the copper deposition box; the containing mechanism comprises a containing box and a containing plate body, the containing plate body is arranged in the containing box, connecting columns are fixedly connected to the front side and the rear side of the containing plate body, the connecting columns are fixedly connected with the inner wall of the containing box, a square groove is formed in the upper side of the containing plate body, and the interior of the square groove is rotationally connected with a containing side plate through a connecting shaft. The connecting shaft penetrates t