Electroplating copper column hanger

• Main Authors: YIN WANG, YIN KANG, NI YULIN, XU XINZHI
• Format: Patent
• Language: Chinese; English
• Published: 07.05.2024
• Subjects: APPARATUS THEREFOR; CHEMISTRY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

The utility model discloses an electroplating copper column hanger which comprises a single-face bottom plate, a fixing groove is formed in one side of the single-face bottom plate, an installation groove is formed in the top of the side, away from the fixing groove, of the single-face bottom plate, a conducting strip is arranged in the installation groove, a wafer is connected to the inner side of the fixing groove in a clamped mode, and a pressing ring is arranged at the bottom of a cover plate. And a single-sided conductive sealing ring is arranged on one side, close to the fixing groove, of the conductive sheet. Through the arrangement of the single-sided conductive sealing ring, the pressing ring, the cover plate and the conductive sheet, the single-sided conductive sealing ring can fix a wafer and seal the groove so that an electroplating conductive wire in the groove cannot enter an electroplating solution, and the pressing ring can fix the conductive sheet without deformation and fix the sealing ring