Thickness detection device and chamfering machine

• Main Authors: YIN DEZHEN, NIU YINXING, LU KAIWEN
• Format: Patent
• Language: Chinese; English
• Published: 23.04.2024
• Subjects: DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; TRANSPORTING

The utility model relates to the technical field of processing equipment, in particular to a thickness detection device and a chamfering machine. The utility model aims to solve the technical problem that the existing thickness detection device is not reasonable in structural arrangement and easily causes damage to a wafer. In order to achieve the purpose, the thickness detection device comprises a fixing component, a supporting cantilever and a thickness detection assembly, the first end of the supporting cantilever is fixedly connected with the fixing component, and the thickness detection assembly is installed at the second end of the supporting cantilever. According to the thickness detection device of the utility model, the supporting cantilever is arranged to install the thickness detection assembly, and the thickness detection assembly is installed at one end, far away from the fixing member, of the supporting cantilever, so that the periphery of the thickness detection assembly is relatively open, a w