High-precision semiconductor vacuum coating heating disc
The utility model provides a high-precision semiconductor vacuum coating heating disc, which comprises a heat transfer matching component, an electric heating component, an inner-layer shielding component, an inner-layer cooling component, an outer-layer shielding component, an outer-layer cooling c...
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Main Author | |
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Format | Patent |
Language | Chinese English |
Published |
16.04.2024
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Subjects | |
Online Access | Get full text |
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Summary: | The utility model provides a high-precision semiconductor vacuum coating heating disc, which comprises a heat transfer matching component, an electric heating component, an inner-layer shielding component, an inner-layer cooling component, an outer-layer shielding component, an outer-layer cooling component and a switching positioning component, and is characterized in that an inner-layer coil pipe communicated with cold water equipment is arranged in an inner-layer cover plate; the inner-layer cover plate and the heat transfer base plate are cooled through the inner-layer coil pipe, so that the heating coil pipe containing the heating wire in the heat transfer base plate can adjust the temperature of the heat transfer base plate together with the inner-layer coil pipe, the adjusting speed is higher and more accurate, meanwhile, the outer-layer cover plate with the outer-layer coil pipe is arranged above the inner-layer cover plate, and the heat transfer effect is better. The heat insulation cavity is formed |
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Bibliography: | Application Number: CN202322603410U |