Thermal diffusion device and electronic apparatus

• Main Authors: NUMOTO TATSUHIRO, MORIKAMI MASASHI
• Format: Patent
• Language: Chinese; English
• Published: 12.04.2024
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The utility model relates to a thermal diffusion device and electronic equipment. The utility model provides a heat diffusion device capable of improving the maximum heat transfer capacity. A vapor chamber (1), which is one embodiment of a heat diffusion device, is provided with: a housing (10) having a first inner surface (11a) and a second inner surface (12a) that face each other in the thickness direction (Z); a working medium (20) sealed in the internal space of the housing (10); and a core body (30) disposed in the internal space of the frame body (10), the core body (30) comprising a support body (31) in contact with the first inner surface (11a) and a perforated body (32) in contact with the support body (31), and the edge of the core body (30) being bent so as to approach the second inner surface (12a) side. 本实用新型涉及热扩散器件以及电子设备。本实用新型提供一种能够提高最大热输送量的热扩散器件。作为热扩散器件的一个实施方式的均热板(1)具备：框体(10)，具有在厚度方向(Z)上对置的第一内表面(11a)及第二内表面(12a)；工作介质(20)，被封入于框体(10)的内部空间；以及芯体(30)，配置于框体(10)的上述内部空间，芯体(30)包括与第一内表面(11a)接触的支承体(31)、和与支