Semiconductor test structure

The utility model provides a semiconductor test structure. The semiconductor test structure comprises a plurality of sub-test structures, and each sub-test structure comprises a first metal layer which comprises two first metal structures; the second metal layer is located on the surface of the firs...

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Bibliographic Details
Main Authors SONG YONGLIANG, DONG WEICHUN, LIU QIANQIAN
Format Patent
LanguageChinese
English
Published 12.04.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
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Summary:The utility model provides a semiconductor test structure. The semiconductor test structure comprises a plurality of sub-test structures, and each sub-test structure comprises a first metal layer which comprises two first metal structures; the second metal layer is located on the surface of the first metal layer in the first direction, and the second metal layer comprises a metal strip; the contact block is positioned between the first metal layer and the second metal layer and is used for connecting one end of the metal strip to the corresponding first metal structure; the sub-test structure further comprises positioning blocks which are located on the two sides of the contact block in the second direction and the third direction so as to achieve rapid positioning of the contact block. According to the technical scheme, the positioning blocks are arranged on the two sides of the contact block in the second direction and the third direction respectively, rapid positioning and direct slicing of the contact blo
Bibliography:Application Number: CN202322367216U