Die bonding equipment

• Main Authors: ZENG GUOPENG, LAN LISAN
• Format: Patent
• Language: Chinese; English
• Published: 22.03.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The utility model provides die bonding equipment. The die bonding equipment comprises a machine table; the feeding mechanism is mounted on the machine table; the carrying mechanism comprises a transfer head, a first driver used for driving the transfer head to ascend and descend and a second driver used for driving the first driver to move in the length direction of the machine table, a plurality of adsorption positions used for adhering crystal grains are arranged on the transfer head, and the power output end of the first driver is connected with the transfer head; the power output end of the second driver is connected with the first driver, and the second driver is installed on the machine table. And the die bonding table is arranged on the machine table. According to the die bonding equipment provided by the invention, the transfer head can suck the plurality of crystal grains on the wafer at the same time, and the synchronous movement of the plurality of crystal grains is realized, so that the plurality