Novel heat dissipation structure

• Main Authors: ZHOU YOUCHUAN, YANG XIAOLAN, CHEN YUANFENG, YE CHAO
• Format: Patent
• Language: Chinese; English
• Published: 02.02.2024
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The utility model discloses a novel heat dissipation structure, and relates to the technical field of radiators. Fan assemblies are slidably connected to one side of a heat dissipation box, clamping assemblies are fixedly connected to the top and the bottom of the heat dissipation box, and a cover plate assembly is inserted into the side, away from the fan assemblies, of the heat dissipation box. Through the arrangement of the fan assembly, the heat dissipation range of the heat dissipation device can be enlarged, the heat dissipation device can evenly dissipate heat, the service life of the heat dissipation fan can be prolonged, when the heat dissipation fan needs to be replaced and maintained, the heat dissipation fan can be directly disassembled, and the replacement and maintenance difficulty is reduced; according to the heat dissipation device, the heat energy receiving plate can be mounted and dismounted easily, dust and impurities accumulated in the heat energy receiving plate can be wiped and cleaned c