Atomic layer deposition apparatus

• Main Authors: CHEN QINGYAO, PAN LIJUN, BAI HAIJIAN, ZHANG ENCI
• Format: Patent
• Language: Chinese; English
• Published: 19.01.2024
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The utility model relates to the technical field of semiconductor production equipment, in particular to atomic layer deposition equipment which comprises a bottom cover and a vacuum ring, and the bottom cover is provided with an annular groove which is concentrically distributed with the bottom cover; and the vacuum ring is embedded in the annular groove. According to the atomic layer deposition equipment, the coaxiality of the vacuum ring mounted on the bottom cover can be ensured, and the mounting efficiency of the vacuum ring can be improved. 本实用新型涉及半导体生产设备技术领域，具体而言，涉及一种原子层沉积设备，其包括底盖和真空环，底盖设置有与其同心分布的环形槽；真空环嵌设于环形槽内。本实用新型的原子层沉积设备能够保证真空环安装于底盖的同轴度，并能提高真空环的安装效率。