Bubble removal type high-quality dispensing structure

• Main Authors: LI HAIQIANG, CHEN RONGKAI
• Format: Patent
• Language: Chinese; English
• Published: 02.01.2024
• Subjects: APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; PERFORMING OPERATIONS; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING

The bubble removing type high-quality dispensing structure comprises a colloid accommodating bin, a colloid outlet channel is arranged at the bottom of the colloid accommodating bin, a colloid extrusion plate is arranged corresponding to the colloid outlet channel, colloid extrusion holes are uniformly formed in the colloid extrusion plate, and a small-hole type glue discharging and bubble removing structure is formed by arranging a glue pressing head corresponding to the colloid extrusion plate. And meanwhile, the vacuumizing module is arranged corresponding to the glue accommodating bin, so that the quick bubble removal type glue dispensing structure is formed. 本实用新型气泡去除式高质量点胶结构，包括胶体容纳仓，胶体容纳仓底部设置有胶体出口道，对应胶体出口道，设置有胶体挤出板，胶体挤出板上均匀设置有胶体挤出孔，通过对应胶体挤出板设置压胶头，形成小孔式出胶除气泡结构，同时通过对应胶体容纳仓进行抽真空模组设置，形成快速气泡去除式点胶结构。