Wafer receiving platform, silicon wafer conveying device and coating system
The utility model relates to a wafer receiving platform, a silicon wafer conveying device and a coating system. The wafer receiving platform comprises a bearing piece. The bearing piece is provided with a bearing face used for bearing the silicon wafers and a plurality of positioning pieces which ar...
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Main Authors | , , , , |
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Format | Patent |
Language | Chinese English |
Published |
29.12.2023
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Subjects | |
Online Access | Get full text |
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Abstract | The utility model relates to a wafer receiving platform, a silicon wafer conveying device and a coating system. The wafer receiving platform comprises a bearing piece. The bearing piece is provided with a bearing face used for bearing the silicon wafers and a plurality of positioning pieces which are arranged on the bearing face and used for abutting against and positioning the silicon wafers. The positioning piece comprises a positioning section and a guiding section connected with the positioning section. The positioning section is connected with the bearing surface, the positioning section is used for abutting against the side edge of the silicon wafer for positioning, the guiding section is provided with a guiding surface, and the distance S between the guiding surface and the central axis O of the positioning piece is gradually increased in the direction from the top end of the guiding section to the bottom end of the guiding section. In the process that the silicon wafer is placed on the bearing face in |
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AbstractList | The utility model relates to a wafer receiving platform, a silicon wafer conveying device and a coating system. The wafer receiving platform comprises a bearing piece. The bearing piece is provided with a bearing face used for bearing the silicon wafers and a plurality of positioning pieces which are arranged on the bearing face and used for abutting against and positioning the silicon wafers. The positioning piece comprises a positioning section and a guiding section connected with the positioning section. The positioning section is connected with the bearing surface, the positioning section is used for abutting against the side edge of the silicon wafer for positioning, the guiding section is provided with a guiding surface, and the distance S between the guiding surface and the central axis O of the positioning piece is gradually increased in the direction from the top end of the guiding section to the bottom end of the guiding section. In the process that the silicon wafer is placed on the bearing face in |
Author | YANG RUIMIN FAN XILONG GANG LIGANG QI WENLONG YANG CHAO |
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DocumentTitleAlternate | 接片平台、硅片输送装置与镀膜系统 |
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Snippet | The utility model relates to a wafer receiving platform, a silicon wafer conveying device and a coating system. The wafer receiving platform comprises a... |
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SubjectTerms | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
Title | Wafer receiving platform, silicon wafer conveying device and coating system |
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