Wafer receiving platform, silicon wafer conveying device and coating system

• Main Authors: GANG LIGANG, YANG CHAO, FAN XILONG, YANG RUIMIN, QI WENLONG
• Format: Patent
• Language: Chinese; English
• Published: 29.12.2023
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The utility model relates to a wafer receiving platform, a silicon wafer conveying device and a coating system. The wafer receiving platform comprises a bearing piece. The bearing piece is provided with a bearing face used for bearing the silicon wafers and a plurality of positioning pieces which are arranged on the bearing face and used for abutting against and positioning the silicon wafers. The positioning piece comprises a positioning section and a guiding section connected with the positioning section. The positioning section is connected with the bearing surface, the positioning section is used for abutting against the side edge of the silicon wafer for positioning, the guiding section is provided with a guiding surface, and the distance S between the guiding surface and the central axis O of the positioning piece is gradually increased in the direction from the top end of the guiding section to the bottom end of the guiding section. In the process that the silicon wafer is placed on the bearing face in