Heat dissipation structure for circuit module and electronic equipment

• Main Authors: WANG XIAOWEI, CHEN KEKE, OU WENKUN, LI DIJIA, HUANG CHONGJUN, FENG YUFENG, ZHANG KEFEI, XIAO TAO
• Format: Patent
• Language: Chinese; English
• Published: 26.12.2023
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

A heat dissipation structure for a circuit module includes: a housing; the circuit board is arranged in the shell; an electronic device; the electronic device is mounted on the circuit board; a heat dissipation pad; the heat dissipation bonding pad is arranged on the circuit board on one side of the electronic device; a heat sink; the heat dissipation piece is installed on the heat dissipation bonding pad and the electronic device. And the heat-conducting glue is arranged in the shell and wraps all the components. Heat generated by the electronic device can be led out by arranging the heat dissipation bonding pad beside the electronic device and additionally arranging the heat dissipation piece. The heat dissipation area is further increased through wrapping of the heat-conducting glue, the outer side face of the heat-conducting glue is connected with the shell, finally heat is transferred layer by layer and conducted to the shell, the final heat dissipation area is increased, the heat dissipation efficiency