Combined laser cutting die capable of saving substrates

• Main Author: XIE ZHIYI
• Format: Patent
• Language: Chinese; English
• Published: 14.11.2023
• Subjects: CUTTING; CUTTING-OUT; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING,CUTTING-OUT, STAMPING-OUT OR SEVERING; HAND CUTTING TOOLS; PERFORATING; PERFORMING OPERATIONS; PUNCHING; SEVERING; SEVERING BY MEANS OTHER THAN CUTTING; STAMPING-OUT; TRANSPORTING

The utility model relates to the field of laser cutting dies, in particular to a combined laser cutting die capable of saving substrates, which comprises a laser cutting die main substrate, a small-pattern laser cutting die and a small-pattern laser cutting die metal support plate. The shape and the size of a mounting hole in the center of the laser cutting die main substrate are consistent with those of an outer frame of a small-pattern laser cutting die, a small-pattern laser cutting die metal supporting plate is mounted below the mounting hole, and a through hole smaller than the mounting hole is formed in the center of the small-pattern laser cutting die metal supporting plate. A step is formed after the small-pattern laser cutting die metal supporting plate and the laser cutting die main substrate are installed, and the step is used for fixing the small-pattern laser cutting die when the small-pattern laser cutting die is placed into an installation hole of the laser cutting die main substrate and preven