Heat dissipation device and power amplifier

• Main Authors: SONG XIAOWEI, JIA PENGCHENG, KONG XIANGMING, ZHANG DONGHUA
• Format: Patent
• Language: Chinese; English
• Published: 03.11.2023
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The utility model discloses a heat dissipation device and a power amplifier, which are applied to the technical field of heat dissipation devices and are used for solving the problem that a traditional heat dissipation device in the prior art cannot meet the requirement of targeted heat dissipation for the temperature of each power amplifier tube of the power amplifier. The heat dissipation device provided by the utility model comprises at least one refrigeration module and a heat dissipation module, the first surface of each refrigeration module is fixedly arranged on the first surface of the heat dissipation module, an external heating device is arranged on the second surface of each refrigeration module, and the first input end and the second input end of each refrigeration module are respectively connected with an external power supply; the refrigeration module is used for producing cold energy and reducing the temperature of an external heating device; the heat dissipation module is used for absorbing he