Thermal shock test device for electrostatic chuck

The utility model relates to the field of test equipment, and discloses an electrostatic chuck thermal shock test device which comprises a chuck connecting tool, a water cooling base, a bonding layer, a ceramic plate body and a heating mechanism which are sequentially arranged from top to bottom, a...

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Bibliographic Details
Main Authors WANG SHUAI, FENG JIKUAN, LI YINGDA, ZHAO SHIKE
Format Patent
LanguageChinese
English
Published 31.10.2023
Subjects
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
PHYSICS
TESTING
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Summary:The utility model relates to the field of test equipment, and discloses an electrostatic chuck thermal shock test device which comprises a chuck connecting tool, a water cooling base, a bonding layer, a ceramic plate body and a heating mechanism which are sequentially arranged from top to bottom, a lifting mechanism which is connected with the chuck connecting tool and can drive the chuck connecting tool to vertically move is arranged on the side face of the chuck connecting tool, the chuck connecting tool is detachably connected with the water cooling base, and the water cooling base is connected with the ceramic plate body through a bonding layer. The thermal shock test device for the electrostatic chuck aims at the electrostatic chuck with a bonding structure, can evaluate the reliability of a bonding layer by simulating temperature rise and temperature reduction in a technological process, and has the advantages of being simple and convenient to operate and capable of corresponding to actual working condi
Bibliography:Application Number: CN202320538196U