Electroplating device

The electroplating device comprises a groove piece, a circulating pump and a pipeline set, the groove piece is provided with an electroplating groove and a liquid outlet communicated with the electroplating groove, an inlet of the circulating pump is communicated with the liquid outlet through a fir...

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Bibliographic Details
Main Authors LU WENXIN, DU TENGHUI, TAN WENLING
Format Patent
LanguageChinese
English
Published 31.10.2023
Subjects
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Summary:The electroplating device comprises a groove piece, a circulating pump and a pipeline set, the groove piece is provided with an electroplating groove and a liquid outlet communicated with the electroplating groove, an inlet of the circulating pump is communicated with the liquid outlet through a first pipeline, and the pipeline set is provided with a liquid conveying channel, a liquid inlet communicated with the liquid conveying channel, a first liquid outlet and a second liquid outlet. The pipeline group is connected with the circulating pump, so that an outlet of the circulating pump is communicated with the liquid inlet, and the first liquid outlet and the second liquid outlet are respectively formed in two sides in the electroplating bath and are oppositely arranged. Through the structure, the plating solution pumped from the solution outlet by the circulating pump passes through the solution conveying channel and then is discharged from the first solution outlet and the second solution outlet, and the pl
Bibliography:Application Number: CN202320977048U