Semiconductor packaging structure with temperature equalizing function

• Main Authors: CHEN FAJUN, YAN ZHIYANG, PANG LONGJI, YUAN XUEPENG, TANG YONG, YAO JIANFENG, CHEN YIXI
• Format: Patent
• Language: Chinese; English
• Published: 20.10.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The utility model provides a semiconductor packaging structure with a temperature equalization function. The semiconductor packaging structure comprises a plastic packaging material wrapping layer, a frame base island, frame pins, metal leads and a chip. The frame base island consists of an upper shell plate, a lower shell plate, a liquid absorption core and a powder column; the chip is welded on the frame base island and is connected with the frame pin through a metal lead; the frame base island is wholly wrapped in the plastic package material wrapping layer, and the bottom surface of the frame base island and the frame pins are exposed out of the plastic package material wrapping layer; a micro groove is formed in the upper surface of the molding compound wrapping layer; and the upper shell plate, the lower shell plate, the liquid absorption core and the powder column are prepared by adopting a uniform temperature plate. According to the utility model, the heat conduction capability of the frame base islan