Through-flow through-hole structure of power supply output side

The utility model discloses a power supply output side through-hole structure, a power supply module comprises a power supply input side and a power supply output side, the power supply input side and the power supply output side are respectively arranged in two areas, the power supply input side an...

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Bibliographic Details
Main Authors QU HAIYU, WU JUN
Format Patent
LanguageChinese
English
Published 13.10.2023
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:The utility model discloses a power supply output side through-hole structure, a power supply module comprises a power supply input side and a power supply output side, the power supply input side and the power supply output side are respectively arranged in two areas, the power supply input side and the power supply output side are connected through a bonding pad, and the bonding pad is respectively connected with the power supply input side and the power supply output side through welding copper sheets. A plurality of through-flow through holes are uniformly formed in the periphery of the welding copper sheet connected with the power supply output side, the intervals of the through-flow through holes in the transverse direction or the longitudinal direction are the same, and the shortest distances between the welding copper sheet and the through-flow through holes are the same in the transverse direction or the longitudinal direction. According to the utility model, the through-hole structures near the bond
Bibliography:Application Number: CN202320364651U