SOT bonding wire pressing plate

• Main Authors: TANG JIAYUN, ZHU SHUANGXIN
• Format: Patent
• Language: Chinese; English
• Published: 03.10.2023
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

The SOT bonding wire pressing plate comprises an upper clamp and a lower clamp, the center of the bottom of the lower clamp is provided with a vacuum adsorption port communicated with vacuum adsorption equipment, the center of the surface of the lower clamp is uniformly provided with a plurality of vacuum adsorption holes corresponding to bonding wire positions of an SOT packaging frame, and the vacuum adsorption holes are communicated with the vacuum adsorption port through vacuum adsorption channels. A plurality of positioning holes are uniformly formed in the center of the surface of the upper clamp corresponding to the bonding wire position of the packaging frame, the plurality of positioning holes are formed in a positioning groove in the center of the surface of the upper clamp in multiple groups, pressing convex strips are arranged at the bottom of the upper clamp corresponding to the gap position of the SOT packaging frame, and a plurality of heat dissipation holes are formed in two sides of the surfa