Copper alloy preparation mold with heat dissipation function

• Main Authors: LI SHUHAI, LIU XINKUAN, SONG SHUAISHUAI, SU JINGZHEN, SO KYONG-JIN, SU GUANGDA, MAO ZHIXIANG, WANG CHANGLIANG, KANG NING
• Format: Patent
• Language: Chinese; English
• Published: 03.10.2023
• Subjects: CASTING; CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES; FOUNDRY MOULDING; PERFORMING OPERATIONS; POWDER METALLURGY; TRANSPORTING

The utility model discloses a copper alloy preparation mould with a heat dissipation function, which belongs to the technical field of moulds, and comprises a support bottom frame, a top frame is connected onto the support bottom frame, middle plates are arranged on two sides below the top frame, and movable liquid injection pipe heads connected onto the top frame are arranged on the middle plates in a penetrating manner. According to the copper alloy preparation mold with the heat dissipation function, a movable liquid injection pipe head, a piston frame, a piston plate, a movable frame and a movable heat conduction plate are arranged, the movable heat conduction plate and a contact heat conduction pad move and make contact with a lower mold, meanwhile, a movable plate presses a control switch, and a connecting pump works to inject cooling water into a connecting frame; heat in the lower mold is rapidly discharged through the contact heat conduction pad and the movable heat conduction plate and is taken away