Tungsten copper alloy surface polishing device

• Main Authors: DENG YUANCHUN, DENG YUANFENG
• Format: Patent
• Language: Chinese; English
• Published: 26.09.2023
• Subjects: DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; TRANSPORTING

The utility model belongs to the technical field of tungsten copper alloy machining equipment, and discloses a tungsten copper alloy surface polishing device which comprises a workbench, a material placing table is arranged in the center of the top end of the workbench, vertical plates are arranged on the left side wall and the right side wall of the material placing table correspondingly, and hydraulic push rods are arranged on the sides, close to each other, of the two vertical plates correspondingly; clamping plates are arranged on the sides, close to each other, of the two hydraulic push rods, and a polishing mechanism is arranged on the rear back face of the material placing table; according to the tungsten-copper alloy polishing machine, when tungsten-copper alloy is polished through the polishing machine, dust generated in the polishing process can be subjected to dust falling treatment through water sprayed out of the fixing ring, and in the polishing process, polishing can be directly observed, namel