Wall-mounted pulse power supply and electroplating device

• Main Authors: XIAO MENGDIE, YE XINWEI, YIN XUEFENG, HUANG RUILU
• Format: Patent
• Language: Chinese; English
• Published: 15.09.2023
• Subjects: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS; APPARATUS THEREFOR; BASIC ELECTRONIC CIRCUITRY; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; CONTROL OR REGULATION THEREOF; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; GENERATION; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PRINTED CIRCUITS; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; PULSE TECHNIQUE

The utility model relates to the technical field of pulse electroplating, in particular to a wall-mounted pulse power supply and an electroplating device. The wall-mounted pulse power supply and the electroplating device comprise a shell; the output port is arranged on the end face of one side of the shell in the height direction; the wall hanging plate is formed by extending the vertical edge of the end face of one side of the shell in the width direction towards the length direction and is suitable for enabling the pulse power supply to be installed in a suspended mode; the wire inlet port is arranged on the end surface of the other side of the shell along the height direction; the end face, where the output port is located, of the shell is defined as the top face, the output port is arranged close to an external power utilization end, the end face, where the wire inlet port is located, of the shell is defined as the bottom face, and the wire inlet port is arranged close to an external power supply, so that