PCB substrate structure

• Main Authors: ZHONG GENDAI, WAN XIAOLIANG, WANG JIAMIN
• Format: Patent
• Language: Chinese; English
• Published: 08.09.2023
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The utility model discloses a PCB substrate structure, the milled surface of a PCB substrate is provided with M grooves, the surfaces of the PCB substrate and the grooves are covered with electro-coppering layers, and the upper surfaces, far away from the substrate, of the electro-coppering layers are flush with each other; m is an integer greater than 0. According to the PCB substrate structure provided by the utility model, a 3D combined structure is formed between the PCB substrate and the electro-coppering layer, the binding force between the PCB substrate and the electro-coppering layer is improved, and the principle is that the electro-coppering layer expands and deforms in the XY direction under the condition of heating, and the acting force on the electro-coppering layer can be counteracted due to the fact that a base material is planted in the groove, so that the bonding force between the PCB substrate and the electro-coppering layer is reduced, and the bonding force between the PCB substrate and the