Chip mounting device for integrated circuit processing

• Main Author: WU YINMING
• Format: Patent
• Language: Chinese; English
• Published: 25.08.2023
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The utility model provides a chip mounting device for integrated circuit processing, which comprises a processing box, a placing assembly is arranged in the processing box, the placing assembly comprises two fixing plates, the two fixing plates are internally provided with mounting grooves, the two mounting grooves are internally provided with mounting blocks, and the mounting blocks are arranged in the mounting grooves. A placing seat is connected between the two mounting blocks; and the hydraulic telescopic rod is installed on the top of the processing box, and the bottom end of the hydraulic telescopic rod is connected with an extrusion plate. According to the chip mounting device for integrated circuit processing provided by the utility model, the fixing plates with the mounting grooves are arranged on the two sides of the inner wall of the processing box and are matched with the placement seats with the mounting blocks for use, so that solder paste adhered to the inner walls of the placement seats can be