Heating body, atomization assembly and electronic atomization device
The utility model provides a heating body, an atomization assembly and an electronic atomization device. The heating body comprises a compact base body and a heating film. The compact matrix comprises a first surface and a second surface opposite to the first surface; a plurality of micropores are f...
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Main Authors | , , , |
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Format | Patent |
Language | Chinese English |
Published |
11.08.2023
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Subjects | |
Online Access | Get full text |
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Summary: | The utility model provides a heating body, an atomization assembly and an electronic atomization device. The heating body comprises a compact base body and a heating film. The compact matrix comprises a first surface and a second surface opposite to the first surface; a plurality of micropores are formed in the compact substrate, are through holes and are used for guiding an aerosol generating substrate to the first surface; the heating film is formed on the first surface; wherein the ratio of the thickness of the compact matrix to the aperture of the micropores is (20: 1)-(3: 1). Through the arrangement, the porosity of the heating body can be accurately controlled, and the consistency of products is improved; in addition, the heating body can achieve sufficient liquid supply in the working process, and liquid leakage can also be prevented.
本申请提供一种发热体、雾化组件及电子雾化装置,发热体包括致密基体和发热膜;致密基体包括第一表面以及与第一表面相对的第二表面;致密基体上设置有多个微孔,微孔为通孔,微孔用于将气溶胶生成基质导引至第一表面;发热膜形成于第一表面上;其中,致密基体的厚度与所述微孔的孔径的比例为20:1-3:1。通过上述设置,使得发热体的孔隙率的大小可精确控制,提 |
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Bibliography: | Application Number: CN202190000261U |