Heat-conducting aluminum substrate for aluminum-based printed circuit board

• Main Authors: LIU SHITENG, REN JUANHONG, ZHANG QIAO
• Format: Patent
• Language: Chinese; English
• Published: 08.08.2023
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The utility model discloses a heat-conducting aluminum substrate for an aluminum-based printed circuit board, which comprises an aluminum substrate body, a plurality of through convection holes are arranged on the side surface of the aluminum substrate body, and the convection holes are through holes with different diameters. Heat is conducted to the aluminum substrate in a heat conduction mode, when the heat in the aluminum substrate is conducted to the convection holes, due to the fact that the convection holes are through holes with different diameters and the directions of the adjacent convection holes are opposite, the air flow speeds at the two ends are different, pressure difference is generated, under the action of hot air, the chimney negative pressure air draft effect is generated, and the heat exchange effect is improved; the heat exchange surface is enlarged, and the heat exchange efficiency is improved. 本实用新型公开了一种铝基印刷线路板用导热铝基板，包括铝基板本体，铝基板本体侧面设有若干个贯穿的对流孔，对流孔为异径通孔。热量通过热传导的形式传导至铝基板上，铝基板内部的热量热传导到达对流孔