Horizontal hot filament chemical vapor deposition equipment

• Main Authors: WANG CHENGUANG, TAN XIAOHUA, ZHANG HAITAO, ZHAO BUJU, CHENG PEIYONG, LIU SHUN, YANG FUMAN
• Format: Patent
• Language: Chinese; English
• Published: 01.08.2023
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The utility model discloses horizontal hot filament chemical vapor deposition equipment, which comprises a coating chamber, a plurality of conductive components, a conveying component and a gas supply component, each conductive component comprises a conductive terminal and a first heat insulation piece, the plurality of conductive components are arranged in an array mode along the horizontal direction, the conductive components are connected with a conductor through a hot filament to form a series loop, and the conveying component is connected with the gas supply component through a second heat insulation piece. The conveying assembly is used for bearing and conveying a to-be-plated substrate in the horizontal direction, and the gas supply assembly is used for filling process gas into the film plating cavity. The substrate to be plated is conveyed in the horizontal direction, falling of the substrate is reduced, the conductive assemblies are arranged in an array mode along the horizontal plane, the conductive