Circuit board packaging mechanism

The utility model discloses a circuit board packaging mechanism which comprises a moving module, a conveying mechanism, a first supporting mechanism and a second supporting mechanism, the moving module drives the conveying mechanism, and the moving module penetrates through the first supporting mech...

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Bibliographic Details
Main Author YOU XIAOHUA
Format Patent
LanguageChinese
English
Published 28.07.2023
Subjects
CONVEYING
HANDLING THIN OR FILAMENTARY MATERIAL
MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGINGARTICLES OR MATERIALS
PACKING
PERFORMING OPERATIONS
STORING
TRANSPORTING
UNPACKING
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Summary:The utility model discloses a circuit board packaging mechanism which comprises a moving module, a conveying mechanism, a first supporting mechanism and a second supporting mechanism, the moving module drives the conveying mechanism, and the moving module penetrates through the first supporting mechanism and the second supporting mechanism; the conveying mechanism comprises a lifting air cylinder, the lifting air cylinder drives a supporting plate, limiting plates used for limiting the circuit board jig are installed on the four edges of the supporting plate, clamping air cylinders are installed on the two corresponding sides of the supporting plate, and the clamping air cylinders drive clamping jaws used for clamping the circuit board jig. According to the circuit board jig stacking device, the telescopic air cylinders are installed on the two corresponding sides of the second frame, the telescopic air cylinders drive the push plates for supporting the circuit board jigs, and when the jigs are jacked to the
Bibliography:Application Number: CN202320159884U