Semiconductor structure and processing device thereof

The utility model relates to a semiconductor structure and a processing device thereof. The processing device of the semiconductor structure comprises a carrying platform and a modification energy source. The stage carries a semiconductor structure having a lattice structure. The modification energy...

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Bibliographic Details
Main Authors YEH WEN-YUNG, KOU CHONGSHAN
Format Patent
LanguageChinese
English
Published 18.07.2023
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Summary:The utility model relates to a semiconductor structure and a processing device thereof. The processing device of the semiconductor structure comprises a carrying platform and a modification energy source. The stage carries a semiconductor structure having a lattice structure. The modification energy source provides a non-uniform modification energy distribution array on the processing target area of the semiconductor structure to form a non-uniform modification area. In the non-uniform modified region, an overlapping region where the processing target region intersects with at least one natural cleavage plane of the lattice structure has a lower degree of modification than a region other than the overlapping region, so as to reduce the generation of lateral cracks extending from the overlapping region along the natural cleavage plane of the semiconductor structure. 本实用新型涉及一种半导体结构及其加工装置。此半导体结构的加工装置包含载台与改质能量源。载台承载具有晶格结构之半导体结构。改质能量源提供一非均匀改质能量分布阵列于半导体结构之加工目标区上,使其形成非均匀改质区。在非均匀改质区中,加工目标区与晶格结构之至少一天然解理面(natural cleav
Bibliography:Application Number: CN202320111712U