Intelligent pump with good heat dissipation performance

• Main Authors: RAN LIBO, WANG FENGXUE, BANG HYUN-GEUN
• Format: Patent
• Language: Chinese; English
• Published: 30.06.2023
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The utility model provides an intelligent pump with good heat dissipation performance, relates to the technical field of biopharmaceutical equipment, and aims to solve the problems that in the prior art, a heat dissipation module is arranged on the back of an intelligent pump, heat dissipation is not uniform, electronic devices in a shell are differentiated, and the performance of the electronic devices is affected; and a heat dissipation window is formed in the shell, so that the sealing effect and the dustproof effect of the shell are poor, and the service life of equipment is shortened. The device comprises a main body and a pump head, a closed accommodating cavity is formed in the main body, a heat dissipation structure, a control module, a signal acquisition module and a driving module are arranged in the accommodating cavity, and the heat dissipation structure is arranged at the top of the main body; the pump head is connected with the driving module and extends out of the main body; and the driving mod