Pressing device for QFN (Quad Flat No-lead) chip

The utility model discloses a pressing device for a QFN chip, which comprises a packaging plate and a supporting plate, the packaging plate with a plurality of packaging areas on the surface is arranged above the supporting plate, a lower pressing plate is arranged on one side of the supporting plat...

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Bibliographic Details
Main Authors LIAO BING, SHEN LIFU
Format Patent
LanguageChinese
English
Published 30.06.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The utility model discloses a pressing device for a QFN chip, which comprises a packaging plate and a supporting plate, the packaging plate with a plurality of packaging areas on the surface is arranged above the supporting plate, a lower pressing plate is arranged on one side of the supporting plate and above the packaging plate, an air cylinder is arranged between the lower pressing plate and the supporting plate, and the air cylinder is connected with the supporting plate. A strip plate with a plurality of through holes is arranged between the lower pressing plate and the packaging plate, the lower pressing plate is fixedly connected with the strip plate, a plurality of pressing blocks with inserting rods at the tops are arranged in the length direction of the strip plate at intervals, the through holes are in sliding connection with the inserting rods, and a buffer spring is arranged between the pressing blocks and the strip plate and arranged on the outer walls of the inserting rods in a sleeved mode. Ac
Bibliography:Application Number: CN202223366758U