Wafer grinding device

• Main Authors: REN RUI, SU YANDONG
• Format: Patent
• Language: Chinese; English
• Published: 26.05.2023
• Subjects: DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; TRANSPORTING

The utility model provides a wafer grinding device. The wafer grinding device comprises a base; the workbench is arranged on the first surface of the base and used for placing a wafer to be ground; the grinding part is used for grinding the wafer placed on the workbench; the at least three supporting pieces comprise at least one fixed supporting piece and at least one adjustable supporting piece; the at least three supporting pieces are all located at the edge position of the second surface of the base and are not located on the same straight line. The adjustable supporting piece comprises a driving piece and a lifting assembly, and the driving piece is used for driving the lifting assembly to ascend and descend so that the inclination angle of the workbench can be adjusted through ascending and descending of the lifting assembly. According to the invention, the adjustment mode of the workbench is changed from manual adjustment to automatic adjustment, the inclination angle of the workbench is convenient to c