Wafer grinding device

The utility model provides a wafer grinding device. The wafer grinding device comprises a base; the workbench is arranged on the first surface of the base and used for placing a wafer to be ground; the grinding part is used for grinding the wafer placed on the workbench; the at least three supportin...

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Bibliographic Details
Main Authors REN RUI, SU YANDONG
Format Patent
LanguageChinese
English
Published 26.05.2023
Subjects
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
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Summary:The utility model provides a wafer grinding device. The wafer grinding device comprises a base; the workbench is arranged on the first surface of the base and used for placing a wafer to be ground; the grinding part is used for grinding the wafer placed on the workbench; the at least three supporting pieces comprise at least one fixed supporting piece and at least one adjustable supporting piece; the at least three supporting pieces are all located at the edge position of the second surface of the base and are not located on the same straight line. The adjustable supporting piece comprises a driving piece and a lifting assembly, and the driving piece is used for driving the lifting assembly to ascend and descend so that the inclination angle of the workbench can be adjusted through ascending and descending of the lifting assembly. According to the invention, the adjustment mode of the workbench is changed from manual adjustment to automatic adjustment, the inclination angle of the workbench is convenient to c
Bibliography:Application Number: CN202223377825U