Heat dissipation foam cushion

• Main Authors: YUAN HUIGANG, WANG XUXU
• Format: Patent
• Language: Chinese; English
• Published: 05.05.2023
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; PRINTED CIRCUITS; USE OF MATERIALS AS ADHESIVES

The utility model discloses a heat dissipation foam cushion, and relates to the technical field of foam cushions. Comprising a foam cushion body, the foam cushion body comprises a base layer and a heat dissipation layer, the base layer is fixed to one side of the heat dissipation layer, the heat dissipation layer comprises a heat conduction foam layer and a CR foam layer, the side wall of the CR foam layer is fixed to one side of the heat conduction foam layer, and the other side wall of the CR foam layer is fixed to the side wall of the base layer. The heat dissipation performance of the foam cushion can be improved through the heat dissipation layer, the heat dissipation layer is composed of the heat conduction foam layer and the CR foam layer, heat conduction foam is formed by wrapping the periphery of foam with various hardness through heat conduction graphite flakes, glue is applied to one face or two faces of the foam, the heat conduction graphite flakes have good heat dissipation performance, and there