Semiconductor device and electronic apparatus

• Main Authors: CUI ZHAOXUE, LIU REN, ZHANG WEI
• Format: Patent
• Language: Chinese; English
• Published: 28.04.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The utility model provides a semiconductor device and electronic equipment. The semiconductor device comprises a semiconductor substrate, a semiconductor chip, a plastic package body, a plurality of first pins and a plurality of second pins. A semiconductor chip mounted on the semiconductor substrate; the plastic package body wraps the semiconductor substrate and the semiconductor chip in a plastic package mode. The plurality of first pins and the plurality of second pins are located outside the plastic package body, the plurality of first pins are fixed on one side of the plastic package body and are arranged at intervals, and the plurality of second pins are located on the other side of the plastic package body and are arranged at intervals; the first pin is electrically connected with the semiconductor substrate, and the second pin is electrically connected with the semiconductor chip; the first welding section of the first pin and the second welding section of the second pin are positioned on two opposite